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X-ray microbeam characterisation of crystalline defects in small pixel GaAs:Cr detectors R. M. Wheater, L. Jowitt, S. Richards [et al.]

Contributor(s): Wheater, R. M | Jowitt, L | Zarubin, Andrei N | Richards, S | Veale, Matthew C | Wilson, Matthew D | Fox, O. J. L | Sawhney, K. J. S | Lozinskaya, Anastassiya D | Shemeryankina, A | Tolbanov, Oleg P | Tyazhev, Anton VMaterial type: ArticleArticleContent type: Текст Media type: электронный Subject(s): арсенид-галлиевые детекторы | методы визуализацииGenre/Form: статьи в журналах Online resources: Click here to access online In: Nuclear instruments and methods in physics research. Section A : Accelerators, spectrometers, detectors and associated equipment Vol. 999. P. 165207 (1-7)Abstract: A newly supplied 80 × 80 chromium compensated GaAs sensor with a matrix of 80 × 80 pixels on a 250 m pixel pitch has been characterised utilising microbeam mapping techniques at the Diamond Light Source. The GaAs:Cr sensor was mounted to a HEXITEC DAQ system before raster scanning an X-ray beam with area 25 × 25 m in steps of 25 m, providing sub-pixel resolution spectroscopic imaging. Scans were performed with incident X-ray energies ranging from 12 to 45 keV. Following processing of the data in MatLab 2019b an analysis of defects previously observed in etched GaAs wafers occurred. Findings indicate the presence of regions with reduced charge collection efficiency where up to 88% of incident events show significant charge loss, and changing charge carrier lifetimes across the sensor.
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A newly supplied 80 × 80 chromium compensated GaAs sensor with a matrix of 80 × 80 pixels on a 250 m pixel pitch has been characterised utilising microbeam mapping techniques at the Diamond Light Source. The GaAs:Cr sensor was mounted to a HEXITEC DAQ system before raster scanning an X-ray beam with area 25 × 25 m in steps of 25 m, providing sub-pixel resolution spectroscopic imaging. Scans were performed with incident X-ray energies ranging from 12 to 45 keV. Following processing of the data in MatLab 2019b an analysis of defects previously observed in etched GaAs wafers occurred. Findings indicate the presence of regions with reduced charge collection efficiency where up to 88% of incident events show significant charge loss, and changing charge carrier lifetimes across the sensor.

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