000			02303nab a2200337 c 4500
001			vtls000623266
003			RU-ToGU
005			20230319212304.0
007			cr |
008			180323|2016 enk s a eng d
024	7		_a10.1088/1757-899X/156/1/012005 _2doi
035			_ato000623266
040			_aRU-ToGU _brus _cRU-ToGU
245	1	0	_aModal testing circuit board assembly of an electronic apparatus by laser vibrometry _cV. A. Krasnoveikin, I. Y. Smolin, N. V. Druzhinin [et.al.]
504			_aБиблиогр.: 11 назв.
520	3		_aThe operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage.
653			_aлазерная виброметрия
653			_aпечатные платы
653			_aвиброакустические нагрузки
655		4	_aстатьи в журналах _9879358
700	1		_aKrasnoveikin, Vladimir A. _9104806
700	1		_aDruzhinin, N. V. _9480939
700	1		_aKolubaev, Evgeniy A. _9101533
700	1		_aDerusova, D. A. _9480940
700	1		_aSmolin, Igor Yu. _9103820
773	0		_tIOP Conference Series: Materials Science and Engineering _d2016 _gVol. 156. P. 012005 (1-7) _x1757-8981
852	4		_aRU-ToGU
856	7		_uhttp://vital.lib.tsu.ru/vital/access/manager/Repository/vtls:000623266
908			_aстатья
999			_c432481