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C60 capping of metallic 2D Tl-Au compound with preservation of its basic properties at the buried interface D. A. Olyanich, V. V. Mararov, T. V. Utas [et al.]

Contributor(s): Mararov, V. V | Utas, T. V | Bondarenko, Leonid V | Tupchaya, Alexandra Yu | Matetskiy, Andrey V | Denisov, N. V | Mihalyuk, Alexey N | Eremeev, Sergey V | Gruznev, Dimitry V | Olyanich, D. A | Zotov, Andrey V | Saranin, Alexander AMaterial type: ArticleArticleContent type: Текст Media type: электронный Subject(s): кремний | фуллерены | атомная структура | электронная структураGenre/Form: статьи в журналах Online resources: Click here to access online In: Applied surface science Vol. 501. P. 144253 (1-7)Abstract: So-called metal-induced silicon reconstructions (i.e., metal films of monolayer or submonolayer thickness epitaxially grown on single-crystal silicon substrates in ultra-high vacuum) represent a specific class of low-dimensional advanced materials with potential prospects for electronic and spintronic applications. However, they are highly vulnerable to air and, thus, require protective capping. Finding a suitable material is a challenging task, since, in general, the metal-induced reconstructions are vulnerable also to overgrowth of solid layers. In the present study, we have found that C60 fullerite film shows up as a proper capping layer for the (Tl, Au)/Si(1 1 1) 7 х 7 compound reconstruction. Due to a perfect non-distractive epitaxial C60 overgrowth, the metallic Tl-Au compound preserves at the deeply buried interface its atomic structure and all basic electronic properties, including spin-splitting of surface-state bands and conductivity of metallic type with a weak antilocalization effect.
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So-called metal-induced silicon reconstructions (i.e., metal films of monolayer or submonolayer thickness epitaxially grown on single-crystal silicon substrates in ultra-high vacuum) represent a specific class of low-dimensional advanced materials with potential prospects for electronic and spintronic applications. However, they are highly vulnerable to air and, thus, require protective capping. Finding a suitable material is a challenging task, since, in general, the metal-induced reconstructions are vulnerable also to overgrowth of solid layers. In the present study, we have found that C60 fullerite film shows up as a proper capping layer for the (Tl, Au)/Si(1 1 1) 7 х 7 compound reconstruction. Due to a perfect non-distractive epitaxial C60 overgrowth, the metallic Tl-Au compound preserves at the deeply buried interface its atomic structure and all basic electronic properties, including spin-splitting of surface-state bands and conductivity of metallic type with a weak antilocalization effect.

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