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Integrated Circuit Packaging, Assembly and Interconnections Электронный ресурс by William J. Greig.
Material type: Computer filePublication details: Boston, MA : Springer Science+Business Media LLC, 2007ISBN: 9780387339139Subject(s): electronics | engineering | Engineering design | Optical materials | Systems engineering | Engineering | Circuits and Systems | Electronics and Microelectronics, Instrumentation | Engineering Design | Optical and Electronic MaterialsOnline resources: Click here to access online In: Springer e-booksNo physical items for this record
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